MFis Develops CAD Tool for Wire Bonding
An electronics product to reach high performance and reliability typically needs several design optimization cycles. Virtual prototyping helps a lot in keeping these cycles short. Finite element simulations reveal how well your product performs, whether it overheats in certain conditions or whether some components undergo mechanical fatigue. Key to fast virtual prototyping is an efficient way to create and modify the geometry of your design.
MFis Wire provides exactly that for wedge and ball bond wire layouts. Create or modify your wire bond layout in minutes and export it to industry standard CAD formats.
Our Engineering Services
We have a strong background in engineering power electronics components, for which high currents, heat, magnetic fields and mechanical stress must be managed at the same time. This multi-disciplinary view enables valuable product analysis and optimization. By transfering tools and methods developed by MFis, we empower your engineers to devolop high performing products.
Finit Element Analysis
fluid flow | heat transfer | mechanical | electro-dynamic
Power Module Design
geometry modelling | virtual prototyping
Data Analysis
scripting | model fitting
Life Time Modelling
physics based | mission profile analysis