Welcome to Multiphysics Engineering

Creating Wire Bond Layouts in Inventor

Bond Wire Layout in Inventor
Manual bond wire modelling in Inventor is now past!

With MFis Wire, bond pads and helper lines sketched in Inventor serve as references for fast, precise bond layout creation. The final geometry updates automatically in Inventor, and all data is stored within the file – ensuring seamless integration with document management systems.

On our YouTube channel, you find a demo video in german.

Contact us for more information, a demo.

Our Engineering Services

We have a strong background in engineering power electronics components, for which high currents, heat, magnetic fields and mechanical stress must be managed at the same time. This multi-disciplinary view enables valuable product analysis and optimization. By transfering tools and methods developed by MFis, we empower your engineers to devolop high performing products.

Hexagonal shapes of bond wire geometry improves meshing in Ansys Q3D
Efficient meshing enabled fast optimization of an IGBT power module.

Finit Element Analysis

fluid flow | heat transfer | mechanical | electro-dynamic

Power Module Design

geometry modelling | virtual prototyping

Data Analysis

scripting | model fitting

Life Time Modelling

physics based | mission profile analysis