Finite Element Analysis
With a strong background in power electronics packaging, where heating, cooling, material fatigue and electro-magnetic interference is highly relevant, we offer engineering and simulation services covering the different fields of physics.
Examples are:
- Predicting the static or transient temperature field in an IGBT power module for DC or PWM load conditions
- Investigating the mechanical impact of temperature fields on dry contacts or weak materials like solder
- Optimizing the pressure drop and thermal resistance of a water cooler
3D Modelling of Bond Wire Layouts
Having developed an excellent tool for 3D modelling, we can offer drafting and optimization of bond wire layouts as a service.
The wires of your product are missing in your 3D CAD?
You want to thermally and electro-magnetically optimize your layout?
Or want to have a bond wire layout proposed for your new product?
We can do that for you.
Fast Electro-Magnetic Optimization
For SwissSEM Technolgies AG, MFis developed the work flow to perform fast electro-magnetic simulations and optimization. This made it possible to draft and virtually benchmark several variants of an IGBT module layout in short time. A publication about this work appeared in the January 2021 issue of Bodo’s Power Systems.
